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AMETEK AEGIS AT A GLANCE

Sealing glass to metal since 1980's, AMETEK Aegis has made its name sealing the most demanding configurations of microelectronic packages in use today. As a business unit of AMETEK Electronic Components and Packaging, Aegis manufactures a full range of industry standard and complex custom packages in both glass and ceramic configurations, to your drawings and technical requirements.
Check-out the Aegis advantage:
  • Scale – we can handle any sized job
  • Technology – an unbeatable combination of engineering expertise and experience
  • Customer Service – real-time product and order status at the customer service desk
  • Quality – designed in and thoroughly tested
  • Supply Chain Management – skills essential to the successful execution of the most complex projectsSubmarine

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PRODUCT SPOTLIGHT

HTCC
   
HTCC
Design advantages of HTCC include
  • highest Input/Output terminal density,
  • weight reduction
  • higher levels of reliability than GTMS and LTCC

  • HTCC Machined Housing Capabilities
    Product features include:
    ✔ Brazed or integral optical fiber snout/ferrule
    ✔ Thermal management bases and inserts
    ✔ Structural ceramic inserts
    ✔ Thin Film Networks
    ✔ Glass or ceramic interconnections
    ✔ DC feed thru terminals
    ✔ RF terminals (SMA, SMP, SSMP)
    ✔ Field replaceable SMA connectors
    ✔ High Temperature Co-fired Ceramic (HTCC) feed thrus
    ✔ Integral mounting feet
    ✔ Brazed mounting studs and hardware

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